Two M-size PCBs can be coated simultaneously (double throughput)
Twin air dispenser allows for fine application of solder paste and so on
Two types of dispensers enable applying different fluids simultaneously in dual stages.
Equipped dispenser
High-precision dispenser Twin-air®ｘ2
Minimum solder application diameter
80 (um)
Mountable PCB size
330 x 250 (mm) 2 sheets
Mountable PCB thickness
5mm
Conveyor dead space
3mm from PCB edge
Height adjustment of PCB
Laser displacement gauge
Position alignment
Auto alignment (Mark: circle or square within 3mm)
Nozzle cleaning
Auto nozzle cleaning and test spray functions
Option
Scale loader and unloader (for auto adjustment function of spray volume)
Air as a driving force
Clean dry air 0.4MPa
Power source
Three-phase AC200V max. 15A(5kVA)
Outer dimensions
840 x 1200 x 1500 (mm), not including protrusions
Weight
Approx. 700 kg
PCB Desiccant Coating System
JC-3325
Enables automatic coating even for small parts of a PCB
Two types of application heads allow for efficient coating
Forms a uniform film thickness due to no scattering outside the coating area
Dedicated software allows easy creation of coating path data
Clear Vision Capturing System enables highly accurate inspection
10μm resolution
Realizes programming compatibility thanks to no differences depending on the device
Illumination difference stereo method enables 3D inspection after solder printing(i-3D)
Multi-platform inspection machine which can use both of SPI and AOI
SPI feedback function which realizes improvement of printing and implementation quality(optional)
Easy-to-use, easy-to-create, and progressive program
Achieves labor savings and high quality control by utilizing TOPSS, the production support system (optional)
Missing component, Position displacement, Polarity, Front/rear reversal, Unsoldered, Bridge, Quantity of solder, Lack of insertion component, Character recognition*1
*1 Optional function
*2 When using optional camera
Note: The above numeric values may vary depending on the conditions. Please contact our sales staff for details.
RV-2-3DH（AOI/SPI）
Overwhelming speed
Large improvement in inspection tact with high-pixel (12 million pixels)
Remarkable accuracy
Using high-resolution lenses improves inspection accuracy of ultra-compact components
Ease of use of rating
Process modes that are easy to use and create, from beginners to senior citizens
Visual inspection automation
RV series, which can also be used for measurement
For improving the efficiency of the entire plant
Achieving the efficiency of the entire factory through system linkage
PCB size
50mm×50mm-410mm×300mm 50mm×50mm-630mm×300mm (action to long board)*1 50mm×50mm-330mm×250mm (action to marking unit)
Shorting, shear, polarity, side-reverse, unsoldered solder, bridge, solder quantity, insertion part omission, character recognition*1
FOV (optimum)
3D
61.8cm²/sec
*1 Optional function
RV-2-3DHL (AOI/SPI)
Overwhelming speed
Large improvement in inspection tact with high-pixel (12 million pixels)
Remarkable accuracy
Using high-resolution lenses improves inspection accuracy of ultra-compact components
Ease of use of rating
Process modes that are easy to use and create, from beginners to senior citizens
Visual inspection automation
RV series, which can also be used for measurement
For improving the efficiency of the entire plant
Achieving the efficiency of the entire factory through system linkage
PCB size
50mm×50mm-410mm×590mm 50mm×50mm-650mm×590mm (action to long board)*1 50mm×50mm-330mm×590mm (action to marking unit)
Shorting, shear, polarity, side-reverse, unsoldered solder, bridge, solder quantity, insertion part omission, character recognition*1
FOV (optimum)
2D
0.20s / frame
3D
61.8cm²/sec
*1 Optional function
Visual Inspection Machine (SE) Series
SE100
The 12 megapixel high frame rate CMOS camera and lighting unit with high-brightness white LED lighting and coaxial lighting enable clear images to be captured
Inspects workpieces up to (W)150mm x (D)150mm x (H)150mm
By installing the automatic Z-axis unit (optional), the height can be automatically adjusted up to 150 mm
Inspection Unit
Camera
12-million-pixel CMOS monochrome camera (standard)
12-million-pixel CMOS color camera (OP)
Lighting unit
White LED 3 levels (top, middle, bottom) + coaxial lighting
Inspection resolution
11.5um (standard)
5.75um（OP)
12um（OP）
5um（OP）
FOV
46.0 x 34.0mm
23.0 x 17.0mm
48.0 x 36.0mm
20.0 x 15.0mm
Inspection time
2D: 1.0 s or less, 2D + i3D: 2.4 s or less
Common Area
Size of mountable workpiece
150 x 150 x 150mm, 20kg or less
Motion axis
Manual Z-axis (standard), Automatic Z-axis (OP)
Environment
During use
Temperature: ambient temperature + 15°C to +35°C, humidity: 30% to 65% (with no condensation)
During storage
Temperature: ambient temperature + 10°C to +60°C, humidity: 30% to 80% (with no condensation)
Automate appearance inspections such as visual and sensory inspections and dimensional inspections that were previously performed by workers
Achieved stable inspection quality and eliminated labor shortages by quantifying the inspection content that previously relied on the intuition of workers
Establishes inspection traceability with automatic storage of inspection data
Operation access levels can be managed to ensure the integrity of inspection data
Statistical management of inspection data enables feedback to manufacturing processes and predictive maintenance
Highly scalable and customizable workpiece handling allows for inspection of complex shaped products
Inspection Unit
Camera
12-million-pixel CMOS monochrome camera (standard)
Lighting unit
White LED 3 levels (top, middle, bottom) + coaxial lighting
Inspection resolution
12um (standard)
5um（OP）
FOV
48.0 x 36.0mm
20.0 x 15.0mm
Inspection time
2D: 0.25 s or less, 2D + i3D: 0.75 s or less
Common Area
Size of mountable workpiece
300 x 600 x 300mm (600 x 600 x 300mm in case of optional delivery)
Motion axis
XY-axis (standard), Z-axis (OP)
Environment
During use
Temperature: ambient temperature + 15°C to +40°C, humidity: 30% to 65% (with no condensation)
During storage
Temperature: ambient temperature + 10°C to +60°C, humidity: 30% to 80% (with no condensation)
Equipped with a special far-infrared radiation panel heater and a heated air circulation system
Minimizes flux adhesion in the oven for extending the maintenance interval
Collects mists with a special filter which can be used repeatedly after cleaning
No need to have a collection unit with less flux fume adhesion in the oven
VFR-408N
VFR-4010N
Outer Dimensions
5661(L) x 1095(W) x 1420(H) mm
6813(L) x 1095(W) x 1438(H) mm
Applicable PCB Size
50(W) x 100(L) – 400(W) x 400(L) mm
Machine Weight
Approx. 2800 kg
Approx. 3000 kg
Conveyor Speed
0.2 – 1.6 m/min
Heating Zone
8 zones
10 zones
Cooling Zone
1 zone for top and bottom cooling
2 zones for top and bottom cooling
Power Source
Three-phase AC200 ± 10% V 48 kVA
Three-phase AC200 ± 10% V 52 kVA
Power consumption in production
Approx. 7.4 kW
Approx. 9.0 kW
Air
0.4 – 0.5 MPa 100 L/min
*Each numerical values are subject to change according to the optional configuration.
Retrofit process automation machine with a point flow soldering
Realizes improvement of soldering quality and reduction of defective rate
Can be replaced with hand-soldering processes caused by labor shortage
ULTIMA Series
Benchtop Selective Soldering Series (CE mark Acquired)
Benchtop Selective Soldering Machine, “ULTIMA-TRZ (CE)”
The CE-certified ULTIMA-TRZ incorporates the below CE standard features
Solder Shortage Alarm, Weekly Timer, Laser-type Wave Height Detection System, Solder Overheat/N2 Overheat Sensor, Three-light Signal Tower, Box-type Safety Cover, Area Sensor
Benchtop Selective Fluxing Machine, “ULTIMA-SPZ (CE)”
The CE-certified ULTIMA-SPZ incorporates the below CE standard features
PCB Presence Sensor, Three-light Signal Tower, Liquid Flowmeter, Safety Cover
Benchtop Preheating Machine, “ULTIMA-PHS (CE)”
CE-certified ULTIMA-PHS-430A
ULTIMA-TRZ
Benchtop Selective Soldering Machine,”“TakuROBO”®
Realizes hand-soldering with various modes and quality improvement of laser soldering
Enables high-mix small lot production with easy operation and program creation
Compact unit with freely adjustable layout. Low pricing for easier initial investment
Outer Dimensions
620(W) x 940(D) x 442(H) mm
Applicable PCB Size
X50 x Y50 – X330 x Y250 (mm)
Machine Weight
Approx. 120 kg
Power Source
Single-phase AC200 ± 10% V 4 kVA
Nitrogen (99.99% purity or more)
0.4 – 0.5 MPa 25 L/min
Solder Pot
Approx. 16 kg
Operation
PCB stage (XYZ) drive
ULTIMA-SPZ
Benchtop Selective Spray Fluxer,“SpROBO”®
Realizes highly efficient flux application under optimal conditions
Enables high-mix small lot production with easy operation and program creation
Two types of nozzles (two-fluids and aerojet) are selectable for flux application
Easy numerical management with the digital flow display
Improved maintainability
Outer Dimensions
630(W) x 910(D) x 390(H) mm
Applicable PCB Size
X50 x Y50 – X330 x Y250 (mm)
Machine Weight
Approx. 60 kg
Power Source
Single-phase AC100 – 240 ± 10% V 0.2 kVA
Air
0.4 – 0.5 MPa
Fluxer
Two-fluids nozzle / Aerojet nozzle
Flux Tank Capacity
0.3 – 0.4 L (maximum)
Operation
Spray gun (XY) drive
ULTIMA-PHS-430A
Benchtop Preheating Machine
Easy operation
Assists preheating of a PCB
Reduces soldering time and improves soldering quality
Realizes high quality soldering by using the carrierless tilting type PCB conveyor and a unique double-wave flow type solder pot
Full-purge system enables soldering in a nitrogen atmosphere
Outer Dimensions
4855(L) x 1400(W) x 1665(H) mm
Applicable PCB Size
50(W) x 120(L) – 350(W) x 450(L) mm
Machine Weight
Approx. 1500 kg
Power Source
Three-phase AC200 ± 10% V 34 kVA
Air
0.5 MPa 30 L/min
Nitrogen (99.99% purity or more)
0.5 MPa 330 L/min
Duct Exhaust Capacity
40 ㎥/min
WS-401LF
Air Atmosphere Tilting Flow Type Solder Pot
Realizes high quality soldering by using the carrierless tilting type PCB conveyor and a unique double-wave flow type solder pot
Outer Dimensions
4020(L) x 1320(W) x 1623(H) mm
Applicable PCB Size
50(W) x 100(L) – 400(W) x 450(L) mm
Machine Weight
Approx. 1500 kg
Power Source
Three-phase AC200 ± 10% V 27 kVA
Air
0.5 MPa 30 L/min
Duct Exhaust Capacity
15 ㎥/min
VIS-400
Inline Type Spray Fluxer
High-performance flux application
A metering pump type or a compressed air type selectable
Retrofit process automation machine with a point flow soldering
Realizes improvement of soldering quality and reduction of defective rate
Inline type for labor saving and automatic changeover (OP)
SELBOIII Model
The independent control mechanism enables module operation and buildup of flexible production lines
New “PCB Warp Detection” feature prevents contact between nozzles and components
The structure that can have multiple spot-dipping pots also supports mass production
Replacement demand is rapidly increasing due to a renewal of deteriorated flow soldering pots
Multiple spray fluxers and preheaters can be used
SELBOIII-350 Model
Fluxer (S/SJ)
Preheat (H)
Solder Pot (D)
Outer Dimensions
910(L) x 1400(W) x 1300(H) mm
Applicable PCB Size
X100 x Y100 – X400 x Y350 (mm)
Machine Weight
Approx. 420 kg
Approx. 370 kg
Approx. 450 kg
Power Source
Three-phase AC200 ± 10% V
2 kVA
14 kVA
6 kVA
Air
0.4 – 0.5 MPa
Nitrogen (99.99% purity or more)
―
―
0.4 – 0.5 MPa 25 L/min
Solder Pot
―
―
Approx. 16 kg
Duct Exhaust Capacity
8 ㎥/min
*The fluxer supports a two-fluids nozzle (S) and a aerojet nozzle (SJ).
*Each numerical values indicate the ones per module. These are subject to change according to the optional configuration or module combination.
SELBOII Model
Various module configurations can be applied according to the product lines
Rich optional configurations enable soldering tailored to each PCB production
The automatic changeover system using barcodes realizes high-mix small lot and mixed flow production
CE-certified model is also available
SELBOII-350 Model
SELBOII-5051 Model
Fluxer (S/SJ)
Preheat (H)
Solder Pot (D)
Fluxer (S/SJ)
Preheat (H)
Solder Pot (D)
Outer Dimensions
910(L) x 1400(W) x 1300(H) mm
1072(L) x 1577(W) x 1300(H) mm
Applicable PCB Size
X100 x Y100 – X400 x Y350 (mm)
X100 x Y100 – X510 x Y500 (mm)
Machine Weight
Approx. 420 kg
Approx. 370 kg
Approx. 450 kg
Approx. 450 kg
Approx. 390 kg
Approx. 480 kg
Power Source
Three-phase AC200 ± 10% V
Three-phase AC200 ± 10% V
2 kVA
14 kVA
6 kVA
2 kVA
20 kVA
6 kVA
Air
0.4 – 0.5 MPa
0.4 – 0.5 MPa
Nitrogen (99.99% purity or more)
―
―
0.4 – 0.5 MPa 25 L/min
―
―
0.4 – 0.5 MPa 25 L/min
Solder Pot
―
―
Approx. 16 kg
―
―
Approx. 16 kg
Duct Exhaust Capacity
8 ㎥/min
8 ㎥/min
*The fluxer supports a two-fluids nozzle (S) and a aerojet nozzle (SJ).
*Each numerical values indicate the ones per module. These are subject to change according to the optional configuration or module combination.
EQS Model
Adapts a one-frame structure and can take 2 or 3-pot configuration for dipping bath
Rich optional configurations enable soldering tailored to each PCB production
The automatic changeover system using barcodes realizes high-mix small lot and mixed flow production
EQS-350S(J)HDD
EQS-350S(J)HDDD
Outer Dimensions
4372(L) x 1400(W) x 1400(H) mm
4800(L) x 1400(W) x 1400(H) mm
Applicable PCB Size
X100 x Y100 – X400 x Y350 (mm)
Machine Weight
Approx. 2000 kg
Approx. 2200 kg
Power Source
Three-phase AC200 ± 10% V 22 kVA
Three-phase AC200 ± 10% V 30 kVA
Air
0.4 – 0.5 MPa
Nitrogen (99.99% purity or more)
0.4 – 0.5 MPa 50 L/min
0.4 – 0.5 MPa 75 L/min
Solder Pot
Approx. 16 kg
Duct Exhaust Capacity
8 ㎥/min (per one location)
*Each numerical values are subject to change according to the optional configuration.
EQSS Series
Small-footprint unit equipped with one solder pot
Expandable up to two solder pots configuration with the add-on modules
EQSS-330S(J)HD
EQSS-330S(J)HD+MD
Outer Dimensions
2622(L) x 1330(W) x 1400(H) mm
3550(L) x 1322(W) x 1400(H) mm
Applicable PCB Size
X100 x Y100 – X250 x Y330 (mm)
Machine Weight
Approx. 850 kg
Approx. 1350 kg
Power Source
Three-phase AC200 ± 10% V 18 kVA
Three-phase AC200 ± 10% V 22 kVA
Air
0.4 – 0.5 MPa
Nitrogen (99.99% purity or more)
0.4 – 0.5 MPa 25 L/min
0.4 – 0.5 MPa 50 L/min
Solder Pot
Approx. 16 kg
Duct Exhaust Capacity
8 ㎥/min (per one location)
*Each numerical values are subject to change according to the optional configuration.
