Information about exhibiting at the 40th Internepcon
Date: January 21st (Wednesday) – 23rd (Friday), 2026 10 am – 5 pm
Venue: Tokyo Big Sight Exhibiting booth of KOKITEC CORP.: East 4 Hall E4-2
Information about visitor registration
Please register using the QR code or via the website below.
Machines to be exhibited
Selective soldering series
■Benchtop/All-in-one type
Exhibiting newly designed “ULTIMA – TRZⅡ/SPZⅡ/NEO-L316” with new colors
■Inline type
Next-generation soldering process will be shown in SELBO III module as reference exhibition
Productivity improvement, traceability
Also exhibiting productivity improvement items such as automated start-up inspection (Dr. Pallet) and tracer (Soldering EYE)
Inspection and measurement inspection machine series
■3D visual inspection machine (RV-2-3DH)
Aggregates functions necessary for inspection processes on mounting lines
Multi-platform inspection machine compatible with SPI, AOI, and moisture-proofing agent application methods
A wide range of options are available for quality and process control
■Non-mounted inspection machine (SE100 + collaborative robot)
“The challenge of being flawless”
Achieves automated visual inspection of machined products with an 11.5μm resolution monochrome camera
Examples of combinations with collaborative robots will be shown
■Micro-defect inspection machine
High-speed 2D inspection and high-precision (1 μm) 3D inspection
Provides the best solution for bump/pattern inspection etc.
2D inspection resolution selectable from 1.1μm/0.55μm/0.275μm
3D inspection resolution XY: 1.2μm/Z: 0.02μm
Exhibition booth information
